PARTICIPATING COMPANIES

 

Amlogic  |  Baidu  |  China Electronics  |  Contact Singapore  |  Cortina System  |

  Intel  |  Intersil  |  Marvell  |  MediaTek  |  PhiHong USA  |  Prudential  |  SIPO  | 

SiliconCore Technology  |   TSMC

Jobfair 2010

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Title Company Location Post date
Technical Lead Engineer (Software) Cortina

N/A

Jun 26, 2010
Senior Application Engineer Cortina

N/A

Jun 26, 2010
Analog circuit design engineer (for CMOS PA) CEC: Huada Electronic Design Co

China

Jun 26, 2010
Product plan engineer (for Wireless Communication IC and System) CEC: Huada Electronic Design Co

China

Jun 26, 2010
RF system engineer (for RFID) CEC: Huada Electronic Design Co

China

Jun 26, 2010
SOC system engineer CEC:Huada Electronic Design Co

China

Jun 26, 2010
Chief Scientist CEC: National Computer System Engineering Research Institue of China

Beijing, China

Jun 26, 2010
Advanced SOC Architecture Design Engineer CEC: Beijing Huahong IC Design Co

Beijing, China

Jun 26, 2010
Advanced Smart Card Technology Researcher CEC: Beijing Huahong IC Design Co

Beijing, China

Jun 26, 2010
Smart Card Architecture Expert (SHHIC005) CEC:Shanghai Huahong Integrated Circuit Co

Shanghai, China

Jun 26, 2010
Security Architecture Expert (SHHIC004) CEC: Shanghai Huahong Integrated Circuit Co

Shanghai, China

Jun 26, 2010
RF Analog Design Leader (SHHIC003) CEC: Shanghai Huahong Integrated Circuit Co

Shanghai, China

Jun 26, 2010
RFIC Design Expert (SHHIC002) CEC: Shanghai Huahong Integrated Circuit Co

Shanghai, China

Jun 26, 2010
Java Card Software Expert (SHHIC001) CEC: Shanghai Huahong Integrated Circuit Co

Shanghai, China

Jun 26, 2010
Digital IC R&D CEO CEC: Nationz Technologies Inc

Shenzhen, China

Jun 26, 2010
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