SEMICON Taiwan IC Design Summit09/04/2015 - 09/04/2015

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IC Design Summit 

In addition to Internet of Things (IoT), the Internet of Vehicles (IoV) and other automotive applications will be the next drive of semiconductor market. According to a recent research by IHS, the value of automotive semiconductor market will continue to grow to US$31 billion this year, with a 7.5% increase from last year. The major contributions are facial/fingerprint recognition systems, quick and wireless charging, panorama photography, collision avoidance systems, integrated security systems and autopilot, which require various types of ICs and are expected to bring prosperity to automotive semiconductors in the years to come.

 

Date: September 4, 2015 (Friday)
Time: 08:30-12:20
Venue: 
Room 521, Nangang Exhibition Center, Hall 1

Theme: Trends & Challenges in Today's Automotive          
             Semiconductors

Outline:

The influence of automobile electronics is rapidly growing and the new chips in the automotive industry keep growing both in functionality and numbers. Increased demand was led by an increase in power semiconductors used in powertrain, infotainment and advanced driver assistance systems (ADAS) applications in automotive applications. Electronics and design automation will play a critical role in shaping the future of automotive by providing design technology that develops high-reliability and safety-critical system.

This year in IC Design Summit, featuring the trend and challenges in today’s automotive semiconductor,speakers from UMC, Broadcom, Imagination, Mentor, NXP, Synopsys and other key players in the industry will share their insights of how IC design plays a critical role in shaping the future of automotive by providing technology for high-reliability and safety-critical system. 

 
Forum Moderator: 

   
Lung Chu
Corp VP, Corp PM Officem, 
GUC

Chairman of CASPA Taiwan

   

Speakers:

Volker H. Politz
VP Segment Marketing

Imagination
Kurt Huang

Director, Corporate Marketing

UMC
Robert Li
Country Manager of Taiwan
Synopsys
Russell Lee
PacRim Technical Director
Mentor Graphics
Mark Chen

Taiwan Country Manager

Broadcom
Waidy Chan

Sr. Director of Greater China Automotive Business

NXP

Forum Agenda:


Time  Topic                                                      
08:30-09:00   Registration
09:00-09:10  Welcome Remarks
09:10-09:35   Security for Connected Cars
09:35-10:00   Foundry's Role in the Accelerating Automotive
 Supply Chain
10:00-10:25   Silicon to Software - Shift Left, Left & Left
10:25-10:35   Break
10:35-11:00  Achieving IC Reliability for Internet of
 Vehicles Application
11:00-11:25   Semiconductor Innovation for Internet of
 
Vehicles
11:25-11:50   Connected Cars
11:50-12:20   Panel Discussion: Trends and Challenges in
 Today's Automotive Semiconductors
12:20-13:30   IC Design Industry Luncheon
 (By Invitation Only)

 Time: 12:00-13:30 (Registration at 11:40)
 Venue: Nangang Exhibition Center, Hall 1

 For Luncheon info, please contact:
 Ms. Cindy Chan
 8868-3-560-1777#305 
 cchan@semi.org

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Event contact
Show Registration Forum Registration
Ms. Jasmine Liu
Tel: +886-3-560-1777 ext. 307/309
Email: semicontaiwan@semi.org
Ms. Irene Ku
Tel: +886-3-560-1777 ext. 508
Email: irene@leadexpo.com
 
 
 
 

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