[SEMI] SEMI Strategic Materials Conference : Scaling Challenges: The Future Of Materials And Packaging09/20/2016 - 09/21/2016

Scaling Challenges: The Future of Materials and Packaging

 

September 20–21, 2016

Computer History Museum

Mountain View, CA 94043
  Register Now  

 

The Strategic Materials Conference—SMC 2016, is a two-day conference that brings together key players from the semiconductor industry ecosystem to share insights on the latest developments in advanced materials. SMC 2016 will delve into what’s driving demand for new materials and packaging and discuss how suppliers are responding to problems posed by existing scaling limitations.

This year’s must-attend event will focus on emerging materials and packaging technology trends across the entire microelectronics supply chain and provide an insider’s outlook for the future. High-profile keynotes will deliver insights on the business drivers behind innovations in device manufacturing and scaling.

SMC 2016 Keynotes

 

  From Materials to Artificial Intelligence—A Deep Learning IC Industry Neuro- network in the Era of System Level Integration

 
  The Overview of China IC Materials Industry and the Growing Market   A Critical Look at Material Challenges Emerging as a Result of Patterning becoming Integrated and Self- aligned  
    Ingrid (Ying) Shi   Anton DeVilliers  
  John Hu, Ph.D.

Director of 

Advanced Technology

Nvidia 
  Ingrid Y. Shi

Secretary-General,

CMTIA, China

The Integrated Circuit Materials Industry Technology Innovative Alliance
  Anton deVilliers, Ph.D.

Director Patterning Technology SMTS

Tokyo Electron America
 

Illuminating sessions plug into today’s marketplace

 

  • Disruptive Trends and Opportunities for New Materials

    Demand for PCs, tablets, and smartphones is slowing. How quickly will new market segments such as IoT, Smart Cars (Automotive Electronics), and wearable devices drive demand for new materials?
 
  • Contamination and Metrology Challenges

    Devices are increasingly sensitive to contaminants, making detection, identification, and control a focal point in fab operations and the supply chain. How will the industry address contamination control issues at advanced technology nodes?
  • Advanced Packaging

    Advanced packaging extends the scaling of advanced devices. As a result, competitors are introducing an array of new proprietary packaging technologies and designs.  Innovation in packaging materials is working hard to keep pace.

     
 
  • Strategic Materials Challenges from the Fab Perspective 

    Facing flat growth, cost sensitivity, and consolidation, the industry must now focus on next materials needs, supply chain issues, and building collaborative, win-win relationships between manufacturers and suppliers.
  • Economic & Market Trends

    Industry and Wall Street experts will present findings on trends in materials, equipment, production, and emerging applications.
 
  • Future of Moore’s Law and Encounters of a 3D Kind

    Will 2D CMOS scaling pace Moore’s Law or will new 3D options be the pathway to keep on track?

     

The Strategic Materials Conferece  provides comprehensive in-depth content and unprecedented networking opportunities for professionals who share common strategic objectives for the extended electronics ecosystem. 

Take a look at the full agenda.

Register Today for SMC 2016.
Register Now

 

 SMC 2016 SPONSORS

SMC 2016 Sponsors

 

Conference Questions

Lin Tso

SEMI

Tel:  1.408.943.7920
 

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