Innovation And Development Of China - US Integrated Circuit Industry12/03/2016 - 12/03/2016

Time: 12/03/2016, 11:30 – 16:30

Venue: ZGC Innovation Center, 4500 Great America Pkwy, Santa Clara, CA 95054

Register: here

Agenda:

  • 11:30 - 13:00: Registration and Networking. 
  •    Free Lunch for first 75 attendees

  • 13:00 - 13:05 : Representatives,The Embassy of the People 's Republic of China in the United States Welcome Speech.
  • 13:05 - 13:10: Mr. Junzhao Lei, President, CASPA Welcome Speech .
  • 13:10 - 13:20: Zhongguancun IC Design Park and ZGC Capital Corporation signed a strategic cooperation agreement.
  • 13:20 - 14:00: Introduction to China 's IC design industry development opportunities.
  •    Mr. Jun Miao, President, Zhongguancun IC Design Park

  • 14:00 - 14:20: Introduction to the construct of Zhongguancun IC design industry innovation and ecosystem.
  •    Mr. Duo Wang, Minister of Market Planning Department, Zhongguancun IC Design Park

  • 14:20 - 14:40: Introduction to the practice of Zhongguancun IC design industry innovation service system.
  •    Ms. Lu Dong, Vice Minister of Industrial Development, Zhongguancun IC Design Park

  • 14:40 - 14:50: Q&A.
  • 14:50 - 15:00: Summary of the meeting.
  • 15:00 - 16:30: Refreshments and Free Networking.

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