Engineer, Senior Manufacturing

Title Engineer, Senior Manufacturing
Company Marvell

Santa Clara,CA


Technical Background: Wafer Bumping process (similar to Fab Processing experience with thin film process background is a plus), Material interface characterization and simulation. Layout experience, Reliability Evaluation, Surface Mounting Technology, Assembly process
* Good understanding of Wafer Level Bumping Process flow and process control
* Hands on experience with wafer level processing (Thin Film, Photo, Etch)
* In depth technical understanding of Material mechanical property, Interface analysis, Stress Simulation
* Familiar with assembly/package types and options including module level or board level surface mounting technology
* Evaluate solder bumping reliability and qualification


Education Background: Master or Ph.D. of Material Science/Chemical Engineering/Mechanical Engineering/Electrical Engineering


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