CASPA eLetter: No. 5, March 15, 2013

Apr 03, 2013

 

 

CASPA eLetter

CHINESE AMERICAN SEMICONDUCTOR PROFESSIONAL ASSOCIATION

Issue No. 5
March 15, 2013

CASPA News & Upcoming Events

CASPA 2013 Spring Symposium a Big Success 

On Saturday March 2, 2013, CASPA successfully held its Spring Symposium at Intel SC12 Auditorium in Santa Clara.  The theme of the symposium was ‘Small Silicon, Big Data’.  The symposium attracted over 200 people to attend.  Many from the audience felt the conference was very informative and some are still interested in learning more from the conference materials.

The symposium invited eight high profile guest speakers to share their opinions on the current hot subject of big data, with their storage and processing, and the related semiconductor chip development trend.  Each speaker presented his/her unique view on this historical trend of big data/cloud computing/consumer-oriented IT and they offered their solutions on the challenges facing semiconductor and other related industries.

In the subsequent panel discussion on ‘hardware readiness for big data era’, four panelists shared their views on the prospect and challenges of data storage technologies.  Many audiences enthusiastically joined the discussion during Q&A and the interaction between the panelists and the audiences was lively, open and constructive.

CASPA 2013 Spring Symposium Highlights

All Symposium Talks Video Playback

  

2013 April Seminar

Automobile Electronics and Electrical Vehicles

Co-host by: CASPA and IEEE CES 

You are cordially invited to join a group of very inspiring speakers to identify the new sparks of future technology and promote next wave technology innovation in Silicon Valley and in the world.
Date:       April 3, 2013, Wednesday, 

Time:       6 – 9 pm
Location:   Cadence Auditorium

               2665 Seely Ave, San Jose, California

Automotive Engine and Drive Train Control Electronics
Ranjit Deshpande, VP of Engineering of Renesas
EV and Battery Management System
Dr Frankie James, Managing Director of GM Advanced Technology of General Motors
Technologies for Touch to enhance the In-Cabin Experience
Bruno Thuillier, CTO at Elo Touch Solutions
Panel Discussion

2013 CASPA High Tech Job Fair

Detail Job Fair Desciption

Hiring Companies:

     Broadcom , Intel, Lenovo, Microsoft, KLA-Tencor, MEMSIC , Synaptics, UMC + more...

           Silicon Valley, CA                

May 4 (Sat), 10 am-4 pm
Marriott Hotel Santa Clara
2700 Mission College Blvd, Santa Clara, CA
           Phoenix, AZ                         
May 2 (Thur), 4-8 pm
Arizona State University
300 E University Dr., Tempe, AZ
          Portland, OR                         
May 6 (Mon), 4-8 pm
Portland State University, Smith Center
1825 SW Broadway, Portland, OR

 

2013年度张家港市领军人才计划(海外人才专场)申报 

为深入实施人才强市战略,进一步加大引进海外高层次人才的引进力度,现决定于20133月举行张家港市领军人才项目评审会(海外人才专场)。

一、申报相关条件: 1.申报人已取得硕士以上学位;2.申报人目前在海外工作或学习,尚未在国内从事全职或兼职工作; 3.申报人掌握申报项目的核心技术,拥有项目专利的所有权或使用权。

二、申报评审程序及时间节点: 1. 材料申报: 24日截止2.项目网评: 27-2203.发放面试评审会通知: 223日之前4.面试评审会: 39; 5.结果公布: 320日之前. 

三、主要扶持政策

1. 项目资助;   2.投融资扶持3.贴息贷款

具体扶持政策信息请登录张家港领军人才网http://www.330.gov.cn/查阅。

申报咨询联系: 傅华 Julia Fu, huajuliafu@yahoo.com, cell: 408-966-7436

 

创业起跑线——2013年度南京321计划创业大赛邀请函


为海内外科技专业人士搭建的高端创业平台,助力海内外专业人士来南京创业发展, 20134月下旬在南京国际博览中心举行"创业起跑线—2013年度南京321计划创业大赛"
征集的项目行业领域:高端软件与新兴信息服务、下一代信息网络、新型显示、生物医药、生物农业、节能环保、智能制造装备、轨道交通、卫星应用、新能源、新能源汽车等。
大赛报名:将于201318日北京时间10点整启动,38日北京时间10点整截止。参赛人员可登陆大赛网站:http://www.nj3000plan.org/ 通过网上报名的方式,逐项提交大赛所需信息。
奖项设置:大赛组委会设置一等奖1项,奖金2万元人民币;二等奖3项,奖金1.5万元人民币;三等奖6项,奖金1万元人民币。决赛获奖人员将获得大赛组委会颁发的获奖证明。
更多获利:在南京落地,3
万元人民币落户奖励申报南京领军型科技创业人才引进计划并入选,100-200万创业启动资金,不少于100平方米工作场所和人才公寓……
更多资讯请点击
: 网站信息

 

2013 苏州国际精英周报名方式: 

烦请向有意向报名的人员提醒一下,报名时在表格的一个栏目“获取信息方式”中填写协会的具体名称 (CASPA会员填写

華美半導體),这是项目作为是哪一个协会推荐的重要统计依据。

苏州精英周报名表

 

项目征集:2013县市级经济浙江第一的宁波慈溪?海外高层次人才对接洽谈会

慈溪市在经济上一直在全国县级市里名列前茅, 连续多年浙江第一。 在人文生活上,慈溪荣膺了“2012 中国最具幸福感城市的称号。 请在 https://sites.google.com/site/2013cixi/welcome 上了解详情。

浙江慈溪市政府将于20135月中旬将组团赴硅谷和波士顿开展慈溪海 外高层次人才对接洽谈会。请拟有意在慈溪创业, 合作和工作的美国高科技人才尽快填写项目报名表( 最好在3月中前提交项目简介), 以方便慈溪有足够的时间去找到对应感兴趣的企业和投资方到美国进行面对面的项目交流。 也非常欢迎虽无法参加在美国的恰谈会, 但有意在慈溪创业, 项目合作或工作的海外人才填写项目报名表, 可按排另外时间和地点恰谈。请在 https://sites.google.com/site/2013cixi/sv-registration 上登记。

慈溪市政府海外人才个人资助主要政策, 省市县累计最高资助500万元;海外人才企业团队资助政策, 市县累计最高资助2500万元。对于不在硅谷或波士顿地区, 但被邀请参加硅谷或波士顿恰谈会的有项目报名的美国高科技人才, 慈溪将根据个人申请和费用收据提供美国国内差旅费补贴(最高3000元(RMB/人)。

 

 

 

Join CASPA Today to Create Brilliant Opportunities in Your Career and Business!

  

CASPA Corporate Sponsor News and Events

Welcome to new and renewed Corporate Members to CASPA's Family in last 3 months:
D
iamond MembersRambus, Walden International秦皇岛经济技术开发区, ASE 

Platinum MembersOracle, Sunlord, Synopsys Inc., HONG KONG DLONG GROUP, Marvell, SMIC, HiSilicon/Huawei, UMC

Gold Members:       LSI Corporation, S3 Graphics, GZICCMasterlife Financial GroupPacific Law Group, SIPO, Atoptech, Neurosky, Pantronix Corp, SynTest

Silver Sponsors:      EMSolutionsFaradayPericom, SiliconCore, Chroma ATE

CASPA Individual Member Benefit Program

 

Corporate Sponsor Job Opening

ICL of ITRI [2/2013]: New Business Talent, Big Data Researcher, Manager of B4G System, Product Manager...

Intel [2/2013]: Logic & Verification Engineer, Strategic Planner 

Synopsys [1/2013]: R&D Engineer, Staff

Link-A-Media Devices [12/2012]: Systems Admin., Analog, Firmware/Software, SSD System, Validation, ASIC, & Apps. Engineers

Grace Semiconductors [12/2012]: Sales Account Manager/Director 

For all Corporate job listing, please check the latest status via web:

http://www.caspa.com/jobs/sponsor 

 

Alliance News  

[NACSA] Beyond Semiconductor: The New Trend Of Technology, Saturday, March 16, 2013, Santa Clara

[CSTIC] China Semiconductor Technology International Conference 2013, March 17-18, 2013, Shanghai, China 

[MJAA] Executive Communication & Decision-Making, Wednesday, March 20, 2013, San Jose

[TTRM] 2013 Taiwan Talent Recruitment Mission: HiRecruit Job Fair, and Forum, Tuesday, April 16, 2013, Milpitas

Thank you for your kind attention and generous support.  We look forward to seeing you at CASPA events.

 

Sincerely,


CASPA

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ARM

 

ASE

 

Broadcom

 

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Microelectronics Limited ("CRM")

 

GLOBALFOUNDRIES

 

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HSBC Bank USA, N.A.

Intel

 

Lenovo

Qinhuangdao Economic & Technological Development Zone

 

Qualcomm

 

Rambus


TSMC

 

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PLATINUM SPONSORS

 

AOpen America, Inc.

 

CEC Capital Management

 

Chunghwa Telecom Global (CHT Global)

 

Deloitte & Touche USA LLP

 

Guangdong Rising Investment Co. Ltd.

 

HiSilicon Technologies

 

Hong Kong DLong Group

 

ITRI International

 

Marvell Semiconductor Inc.

 

MediaTek

 

nVIDIA

 

Oracle

 

Sinochip Semiconductors Co., Ltd

 

Smart Electronic Industry Promotion Office( SIPO)

 

SMIC Americas

 

Sunlord

 

 

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