CASPA eLetter: No. 14, July 30, 2013

Jul 29, 2013





CASPA eLetter

CHINESE AMERICAN SEMICONDUCTOR PROFESSIONAL ASSOCIATION

Issue No. 14

July 30, 2013

 



 


In This Issue

CASPA News & Upcoming Events

CASPA Corporate Sponsor News

Corporate Sponsor Job Openings

Alliance News

 


Chairman's Words

 

The semiconductor industry continues advancement with the Moore's Law in the Post-PC era. More functionalities and usage models have been integrated in the System-on-Chip (SOC) from end user interface to cloud computing. A traditional IC chip now becomes an entire system, while a traditional system gets integrated within one chip. The semiconductor landscape shifts from PC-centric computing to handheld and wearable forms, where a touch, a gesture, a tone, or even a movement from eye-ball can trigger a series of computing from local to cloud devices. During the mega-trend of system going to chip, Intellectual Properties (IP) in Silicon have risen to become increasing important in IC design and integration. What is the golden rule the SOC companies use to decide if they should buy or develop some critical IPs internally?

In CASPA's 2013 summer symposium, we invited leading technologists and world IP experts from Cadence, ARM, Intel, Marvell, Arason and Finnegan, who shared with audiences their views from technology to business aspects on the Silicon IP and its increasing role in the silicon realization today and tomorrow. Over 150 people attended the event, including professionals from South California, Texas and mainland of China.

The CASPA continues its momentum after the summer symposium with following upcoming events. Wish to see all of you in one of these events!

07/31/13 (Wed)         Mentorship workshop II

09/01/2013 (Wed)     Financial Seminar II

09/01 ¨C 09/08/2013   CASPA 2013 SEMICON Taiwan Delegation

09/28/2013(Sat)         Volunteer Mixer II

10/12/2013 (Sat)        2013 Annual Conference & Dinner Banquet


CASPA News & Upcoming Events

 



CASPA Mentorship Seminar 

 

Topic: Think beyond engineering careers

1. Career development & How to excel in the working place by Steve Hwang, Vice President of Development at Seagate Technology LLC

2. Career planning & how to make effective job hunting for new opportunities: Talent Acquisition of Marvell Semiconductor Inc

Each registered attendee will get tips on how to make daily improvement from Steve Hwang.

Time: 7/31/2013 
6:00pm-6:30pm : social 
6:30-8:00pm: seminar

Venue: Keypoint credit union
2805 Bowers Ave. 
Santa Clara, CA 95051

Registration: Free here and refreshment will be provided.

Please click here for more updates.



 

CASPA 2013 Summer Symposium Summary 

 

CASPA's summer symposium was quite a success. It started with the keynote from John Heinlein, VP of marketing from ARM, outlining the grand vision of what the industry moving towards in this post PC era. Mobile, connected devices, and lower power server are a few of the segments seen great growth in the coming years, and SOCs are name of the game in the new era. Second keynote, Beatrice Fu from Cadence drew a vivid picture of application customizable SOC, leading to prediction of the death of IP bazaar, and birth of new IP re-use concept--- IP factory. 

Symposium went on with a heated panel session focusing on "Make v.s Buy", touching the heart of decision making in constructing today's ever complicated SOCs. Panelists from IP provider, IDM, fabless house, and legal firm exchanges their expert's views with each other, and the audience.

The future of silicon realization remains challenging, but many left the symposium feeling energized and inspired that greater opportunities are await for us to explore in the post PC era....

Following is the summary with videos:

CASPA 2013 Summer Symposium Highlights

Introduction

Keynote:       

Beatrice Fu, VP of Marketing, Cadence: Opportunities for Growth in a Connected World

John Heinlein, VP of Marketing, ARM: Challenges &Solutions in SoC Based Design

         

Panel:             Make v.s. Buy-Ingredients for Success in System on Chip (SOC):Video 1Video 2

Yonghua Song, VP, Marvell

Andrew Haines - VP of Worldwide Marketing, Arason

Will Chen, Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

Yi-hung Chee, Senior Director, Intel

Moderator:     Paul McLellan      

 

 





 

CASPA 2013 Education Day Summary

 

CASPA 2013 Education Day-Prepare Your Children for Academic and Financial Success was successfully held on June 9, 2013. For those who missed the event or want to review the event,  please click the following links for videos and presentation materials:

Welcome from CASPA: Video

Introduction to Intel Science Talent Search Program: Video, Presentation slide

Keynote 1: Building academic strength & leadership: Video 1, Video2

Keynote 2: Teaching Kids the Habits for Financial Success and Prosperity: Video, Presentation slide

Panel: Overcome Challenges & Develop Unique Strengths:  Video 1, Video 2



 

2013 CASPA High Tech Job Fair Summary 

Continuous Job Listing from Hiring Companies

Interview with CASPA 2013 Job Fair leaders

Interview with Hiring Company in CASPA 2013 Job Fair

Career Development Forum in CASPA 2013 Job Fair: The "Secret Sauce" of High-Tech Job Search: Your UNIQUE Self, Ron Yu, ExecCatalyst




 

Join CASPA Today to Create Brilliant Opportunities in Your Career and Business!

 

CASPA Corporate Sponsor News and Events

 

SKHMS Onsite Recruitment Fair

Onsite Recruitment Fair at SKHMS will be held on Wed, July 31st, 2013, from 10 am -3pm at SKHM.

HR contact:

Catherine H. Dang

SK hynix memory solutions inc.

3103 N. First St.

San Jose, CA 95134

Ph: (408) 514-3668

Fax: (408) 514-3501



 


Corporate sponsor job openings 

 

SMIC, Americas [06/2013]: Field Application Engineers

TSMC North America [06/2013]:SRAM designer/technical manager positions in San Jose office

Grace Semiconductors [06/2013]: Sales_Account_Manager-Director



 

Job Openings in CASPA 2013 Job Fair

http://www.caspa.com/jobfair2013 


Alliance News  

 

StartmeupHK Venture Programme, 07/19/2013 - 08/26/2013  

Be one of the 12 high impact entrepreneurs who will be invited to join an intensive programme in Hong Kong from Dec 4-7, 2013.  Apply by Aug 26, 2013 via the StartmeupHK website.

 

 



Visit Our Sponsors

DIAMOND SPONSORS

AMD

ARM

ASE

Broadcom

China Resources
Microelectronics Limited ("CRM")

PricewaterhouseCoopers LLP(PwC)

GLOBALFOUNDRIES

Hong Kong Science & Technology Parks Corporation (HKSTP)

HSBC Bank USA, N.A.

Intel

Lenovo

Qinhuangdao Economic & Technological Development Zone

Qualcomm

Rambus


TSMC

VMWare

Walden International

 

DIAMOND ALLIANCE

SEMI China 

PLATINUM SPONSORS

 AOpen America, Inc.

CEC Capital Management

Christopher Huang CPAs Inc.

Chunghwa Telecom Global (CHT Global)

Deloitte & Touche USA LLP

Fuzhong Group

Guangdong Rising Investment Co. Ltd.

Hisilicon Technologies

Hong Kong DLong Group

ITRI International

Marvell Semiconductor Inc.

MediaTek

nVIDIA

Oracle

Sinochip Semiconductors Co., Ltd

Smart Electronic Industry Promotion Office( SIPO)

SMIC Americas

Sunlord

Synopsys Inc.

United Microelectronics Corporation (UMC)

Gold Sponsors

Silver Sponsors

 


Quick Links

 

2013 Job Fair Openings 

CASPA Website

CASPA Event Calendar

Corporate Sponsor Job Openings

eLetter Archives

CASPA Association Alliances

CASPA Industrial Alliances

CASPA Media Alliances

 


Contact Us

 


 
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Tel: (408) 940-4600
 Email:
office@caspa.com
Website:
www.caspa.com