CASPA eLetter: No. 15, August 15, 2013

Aug 22, 2013


CASPA eLetter


Issue No. 15

August 15, 2013



In This Issue

CASPA News & Upcoming Events

CASPA Corporate Sponsor News

Corporate Sponsor Job Openings

Alliance News


Chairman's Words


The semiconductor industry continues the advancement with the Moore's Law in the Post-PC era. With more functionalities and computing components being integrated into one system chip, the semiconductor landscape has shifted from PC-centric computing to handheld, and further to wearable forms. A touch, a gesture, a tone, or even a movement from eyeball can trigger a series of computing from local to cloud devices. In CASPA's 2013 summer symposium, leading technologists and world IP experts from Cadence, ARM, Intel, Marvell, Arason and Finnegan had discussed the mega-trend of Intellectual Properties (IP) playing increasing roles in the SoC solution in the silicon realization today and tomorrow. As the silicon integration gets further, hardware gets closer to applications, and brings a brand new user experience via wearable devices, voice recognition, etc, All electronic devices and interfaces are connected via wireless network. The information collection, processing and presentation from all these connected devices are all instantaneous at our fingertip. Please come to CASPA's last major event of the year -- Annual Conference on Oct 12 (Saturday) in Santa Clara Center, and learn what the future World of Everything is, and the new innovation directions driven by the future semiconductor technologies. 
   Here are the rest events towards the end of the year. Please come and have fun in learning new knowledge and making new friends. 

·  09/4/2013 (Wed)        Financial Seminar II

·  09/02 -- 09/08/2013   SEMICON Taiwan Delegation

·  09/28/2013(Sat)         Volunteer Mixer II

·  10/12/2013(Sat)         Annual Conference & Dinner Banquet


CASPA News & Upcoming Events


CASPA 2013 Financial Seminar II


Date:   Sept. 4 (Wednesday)

Time:   6:00-8:30 pm 

Venue: ITRI US Office

            2870 Zanker Rd  San Jose, CA


Chan Chang Fong, Tax Director, Price Waterhouse Coopers

Christopher Huang, President & Founder, Christopher Huang CPA Inc.

Julia Hsiao, LL.B, J.D.,LL.M. Financial Adviser, NYLIFE 

Registration:  CASPA 2013 Financial Seminar II



CASPA 2013 Student Scholarship


The Chinese American Semiconductor Professional Association (CASPA) is now accepting applications for 2013 Student Scholarship.  The final award recipients will be notified before September 30, 2013 and awards will be presented at the CASPA Annual Conference Dinner Banquet on October 12, 2013.

Following a long-standing tradition of pursuing excellence and community service, CASPA has establishedthis award program to encourage and recognize the outstanding scholastic and special achievements of the children of its members. Selection criteria will be based on a balanced achievement of applicants' academic accomplishments, participation in extracurricular activities, and involvement in community service.  Each award winner will be invited to attend the CASPA 2013 Annual Conference Banquet and receive a Plaque of Merit with one-time cash scholarship.

The deadline for the application is September 15th, 2011 (postmarked).  The award committee will notify the applicants its decision before September 30, 2013 For more information, please contact CASPA Student Scholarship Award Committee representative: Dr .Jason Wang, email:

Please click here to download the announcement and application form.


CASPA 2013 Summer Symposium Summary 


CASPA's summer symposium was quite a success. It started with the keynote from John Heinlein, VP of marketing from ARM, outlining the grand vision of what the industry moving towards in this post PC era. Mobile, connected devices, and lower power server are a few of the segments seen great growth in the coming years, and SOCs are name of the game in the new era. Second keynote, Beatrice Fu from Cadence drew a vivid picture of application customizable SOC, leading to prediction of the death of IP bazaar, and birth of new IP re-use concept--- IP factory. 

Symposium went on with a heated panel session focusing on "Make v.s Buy", touching the heart of decision making in constructing today's ever complicated SOCs. Panelists from IP provider, IDM, fabless house, and legal firm exchanges their expert's views with each other, and the audience.

The future of silicon realization remains challenging, but many left the symposium feeling energized and inspired that greater opportunities are await for us to explore in the post PC era....

Following is the summary with videos:

CASPA 2013 Summer Symposium Highlights



Beatrice Fu, VP of Marketing, Cadence: Opportunities for Growth in a Connected World

John Heinlein, VP of Marketing, ARM: Challenges &Solutions in SoC Based Design


Panel:             Make v.s. Buy-Ingredients for Success in System on Chip (SOC):Video 1Video 2

Yonghua Song, VP, Marvell

Andrew Haines - VP of Worldwide Marketing, Arason

Will Chen, Partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP

Yi-hung Chee, Senior Director, Intel


Moderator:     Paul McLellan      


Join CASPA Today to Create Brilliant Opportunities in Your Career and Business!



CASPA Corporate Sponsor News and Events


Welcome Guangdong Solid State Lighting Industry Innovation Center (GSC) to join CASPA as the diamond sponsor.

Welcome Finnegan, Henderson, Farabow, Garrett & Dunner, LLP to join CASPA as the platinum sponsor.


Corporate sponsor job openings 


AMD(Shanghai)[08/2013]:Principle/Senior Staff Design Architect,Senior Staff/Staff Design Lead

SMIC, Americas [07/2013]: HR and Biz Admin Manager,Field Application EngineerS

SMIC, Americas [06/2013]: Field Application Engineers

TSMC North America [06/2013]:SRAM designer/technical manager positions in San Jose office

Grace Semiconductors [06/2013]: Sales_Account_Manager-Director



Job Openings in CASPA 2013 Job Fair 

Alliance News  




[IEEE]Introducing ComponentCostEstimator (CCE) – A “Game Changing” Power Tool from Lytica, 08/27/2013

Leveraging the statistical models within the world’s largest independent database of ‘Real-World’ pricing of Electronic Components – CCE augments the efforts of Program Managers, NPI Buyers and Component Engineers.



[HYSTA]The first Legend Star-Silicon Valley Entrepreneur/CEO Training Class, 08/31/2013 - 09/2/2013 

Please register and submit application package following this link:

[UCAHP]南京杨卫泽书记, 硅谷人才科技创业恳谈会暨“321计划推介会09/02/2013


[HKETO] StartmeupHK Venture Programme, 07/19/2013 - 08/26/2013  

Be one of the 12 high impact entrepreneurs who will be invited to join an intensive programme in Hong Kong from Dec 4-7, 2013.  Apply by Aug 26, 2013 via the StartmeupHK website.




Visit Our Sponsors




Advanced Semiconductor Engineering Inc.(ASE)




Hong Kong Science & Technology Parks Corporation (HKSTP)





PricewaterhouseCoopers LLP(PwC)

Qinhuangdao Economic & Technological Development Zone





Walden International





SEMI China 


CEC Capital Management

Christopher Huang CPAs Inc.

CHT Global


Fuzhong Group

Hisilicon Technologies

Hong Kong DLong Group

ITRI International

Marvell Semiconductor Inc.




Sinochip Semiconductors Co., Ltd

Smart Electronic Industry

SMIC Americas


Synopsys Inc.


Gold Sponsors

Silver Sponsors


Quick Links


2013 Job Fair Openings 

CASPA Website

CASPA Event Calendar

Corporate Sponsor Job Openings

eLetter Archives

CASPA Association Alliances

CASPA Industrial Alliances

CASPA Media Alliances


Contact Us


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Tel: (408) 940-4600