CASPA eLetter: No. 17, Septermber 15, 2013

Oct 01, 2013

 


 



CASPA eLetter

CHINESE AMERICAN SEMICONDUCTOR PROFESSIONAL ASSOCIATION

Issue No. 16

September 15, 2013

 



 

 


CASPA News & Upcoming Events

 

CASPA 2013 Annual Conference and Dinner Banquet

 

Internet of Everything - Impacts & Opportunities

 

 萬物互聯網之衝擊與商機

 

The semiconductor industry continues the advancement with the Moore's Law in the Post-PC era. With more functionality and computing components being integrated into one system chip, the semiconductor landscape has shifted from PC-centric computing to handheld, and further to wearable forms. A touch, a gesture, a tone, or even a movement from eyeball can trigger a series of computing from local to cloud devices. The mega-trend of Intellectual Properties (IP) plays an increasing role in the silicon SoC solutions, which brings computing core and ASIC much closer to various applications in our lives with brand new user experiences in wearable devices, perceptual computing, voice recognition, deform-able display etc. All these computing devices are connected via wired and wireless communication network with I/O interfaces for information collection, processing and presentation. Semiconductor technologies remain at the kernel to drive the future innovation with ubiquitous and instantaneous computing at both local devices and cloud servers. Please come to CASPA's last major event of the year -- Annual Conference and learn the future impacts and opportunities in the era of Internet of Everything.


 
Date:    October 12, 2013 (Saturday)
Venue: ?Santa Clara Convention Center (map)
              5001 Great America Pkwy, Santa Clara, CA 95054 

Annual Conference Program: Online registration is free and eligible for prize drawing.


12:00   Registration & Networking (FREE refreshments)
12:45   CASPA Annual Election of Board Directors 

13:30   Executive Keynote:
              Mark Papermaster, Chief Technology Officer, AMD

              Ronald Black, Chief Executive Officer, Rambus           

              Ian Ferguson, Vice President of Segment Marketing, ARM  
15:30    Panel Forum:  
              Mario Morales, Vice President, IDC

              Edward Grochowski, Sr. Principal Engineer, Intel

              Dragan Mladenovic, Sr. Director, Fairchild Semiconductor

              Yan Zhuang, Director, Qualcomm

16:50    Prize Drawings

17:00    Conference Adjourns


Dinner Banquet Program  (By Invitation Only)

17:00   Registration & Networking                                       

18:00   Banquet Seating & VIP introduction


18:30   CASPA 2013 Scholarship Award Ceremony      

             CASPA retired Board Director Service Recognition Awards
19:00   Dinner & CASPA 2013 Event Sideshow

19:30   CASPA 2013-2014 Presidential Transition                 


20:00   Executive Keynote: Scott A. McGregor, CEO, Broadcom
20:45   Performance
21:15   Prize Drawings  
21:30   Banquet Adjourns



 

2013 CASPA Board of Directors Election Announcement

 

Dear CASPA members,

 

Each year, CASPA will elect part of its Board of Directors (BOD) at the annual meeting, according to its By-law. In 2013, there will be 10 Directors open to be elected in the upcoming annual conference which will be held on Oct. 12, 2013. Once a candidate is elected to be one of CAPSPA Directors, he/she will serve a 2 years term.

To be qualified as a candidate for BOD election, you have to be an active individual member with at least six months of membership before the election date.

CASPA has grown stronger and more influential in the US and in Asia, with your membership and continuing support. The success of CASPA depends solely on the unselfish devotion of volunteer members.? One opportunity to make a difference to the community and even enhances your professional career is to become a Director of CASPA BOD. It will be a wonderful and memorable personal experience.

You are encouraged to participate in the election. If you are interested and meet the qualification, please email your application with the following info to office@caspa.com. Please use the title of "2013 CASPA BOD Election" for your email,

1)Your full name,

2)Company name and job title, and

3)Your “significant experiences and areas of contributions in your profession” with no more than 100 words.

Our “BOD election committee” will verify your qualification and get in touch with you.

Deadline of submitting your application to 2013 BOD election is Sept. 25, 2013.

 

Best regards,

CASPA BOD Election Committee

Chinese American Semiconductor Professional Association (CASPA)



 

 





Join CASPA Today to Create Brilliant Opportunities in Your Career and Business!

 

 

 

CASPA Corporate Sponsor News and Events

 

Welcome Guangdong Solid State Lighting Industry Innovation Center (GSC) to join CASPA as the diamond sponsor.

Welcome Finnegan, Henderson, Farabow, Garrett & Dunner, LLP to join CASPA as the platinum sponsor.

 


Corporate sponsor job openings 

 

AMD(Shanghai)[08/2013]:Principle/Senior Staff Design Architect,Senior Staff/Staff Design Lead

SMIC, Americas [07/2013]: HR and Biz Admin Manager,Field Application EngineerS

 



 

Job Openings in CASPA 2013 Job Fair

http://www.caspa.com/jobfair2013


Alliance News  


[SVCWireless]Silicon Valley Youth Innovation Forum 2013 -- Welcome Parents & Students, 09/20/2013

The experienced educators will share their knowledge and methodology in developing students for the best universities and the promising careers.

B&W Elites Seminar On "Stay On Top Of Your Career And Health", 09/29/2013

請來聆聽林喬偉剖析半導體科技引領的軟硬體產業全球未來走向,協助您規劃個人生涯,尋求自我定位,覓得人生下半場的策略與方向. 

[CBA]CBA 2013 ANNUAL CONFERENCE,10/05/2013

The Chinese Bioscience Association will host a grand conference on Oct 5.

[SVIEF]2013 Silicon Valley Technology Innovation & Entrepreneurship Forum, 11/2/2013

Silicon Valley Technology Innovation and Entrepreneurship Forum (SVIEF) is a one day conference designed to foster innovation and promote business partnerships between the U.S. and China.

[駐舊金山台北經濟文化辦事處科技組] 國立清華大學海外招生說明會, 09/22/2013

本场活动将由校长主持, 副校长,全球长简介本校及招生方式

[南京组织部高层人才中心]江苏省暨南京市第二十六届高级人才交流洽谈会09/28/2013

中共江苏省委组织部、南京市委组织部将共同主办江苏省暨南京市 第二十六届高级人才交流洽谈会”.

 

 

 

 



Visit Our Sponsors

DIAMOND SPONSORS

AMD

ARM

Advanced Semiconductor Engineering Inc.(ASE)

Broadcom

EastWestBank

GLOBALFOUNDRIES

GSC

Hong Kong Science & Technology Parks Corporation (HKSTP)

HSBC Bank USA, N.A.

 

Intel

Lenovo

PricewaterhouseCoopers LLP(PwC)

Qinhuangdao Economic & Technological Development Zone

Qualcomm

Rambus

TSMC

VMWare

Walden International

 

 

 

DIAMOND ALLIANCE

SEMI China 

PLATINUM SPONSORS

CEC Capital Management

Christopher Huang CPAs Inc.

CHT Global

Finnegan

Fuzhong Group

Hisilicon Technologies

Hong Kong DLong Group

ITRI International

Marvell Semiconductor Inc.

MediaTek

nVIDIA

Oracle

Sinochip Semiconductors Co., Ltd

Smart Electronics Industry Promotion Office

SMIC Americas

Sunlord

Synopsys Inc.

UMC


Gold Sponsors

Silver Sponsors

 


Quick Links

 

2013 Job Fair Openings 

CASPA Website

CASPA Event Calendar

Corporate Sponsor Job Openings

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Contact Us

 


 
CASPA | 1159 Sonora Court, | Suite 105 | Sunnyvale | CA | 94086


 

Tel: (408) 940-4600
 Email:
office@caspa.com
Website:
www.caspa.com