CASPA eLetter: No. 18, Septermber 30, 2013

Oct 01, 2013



CASPA eLetter


Issue No. 18

September 30, 2013




CASPA News & Upcoming Events


CASPA 2013 Annual Conference and Dinner Banquet


Internet of Everything - Impacts & Opportunities


The semiconductor industry continues the advancement with the Moore's Law in the Post-PC era. With more functionality and computing components being integrated into one system chip, the semiconductor landscape has shifted from PC-centric computing to handheld, and further to wearable forms. A touch, a gesture, a tone, or even a movement from eyeball can trigger a series of computing from local to cloud devices. The mega-trend of Intellectual Properties (IP) plays an increasing role in the silicon SoC solutions, which brings computing core and ASIC much closer to various applications in our lives with brand new user experiences in wearable devices, perceptual computing, voice recognition, deform-able display etc. All these computing devices are connected via wired and wireless communication network with I/O interfaces for information collection, processing and presentation. Semiconductor technologies remain at the kernel to drive the future innovation with ubiquitous and instantaneous computing at both local devices and cloud servers. Please come to CASPA's last major event of the year -- Annual Conference and learn the future impacts and opportunities in the era of Internet of Everything.

Date:   October 12, 2013 (Saturday)
Venue: Santa Clara Convention Center (map)
              5001 Great America Pkwy, Santa Clara, CA 95054 

Annual Conference Program (RegistrationHere)

12:00   Registration & Networking (FREE refreshments)

12:30   CASPA Annual Election of Board Directors

13:15   Welcome from CASPA  

13:30   Executive Keynote:
           Mark Papermaster, Chief Technology Officer, AMD
           Ronald Black, Chief Executive Officer, Rambus           

           Ian Ferguson, Vice President of Segment Marketing, ARM  
15:30   Panel Forum:   Moderator:Mario Morales, Vice President, IDC

           Ian Ferguson, Vice President of Segment Marketing, ARM  

           Shane Dyer, President and CEO, Arrayent, Inc

Edward Grochowski, Sr. Principal Engineer, Intel

           Dragan Mladenovic, Sr. Director, Fairchild Semiconductor

           Adrian Woolley, Director of Strategic Marketing, Atmel

17:00   Prize Drawings (Only for those with Online Registration)


Dinner Banquet Program (By Invitation Only, $100 each to buy) 

17:00   Registration & Networking    
18:00   Banquet Seating, Dinner Serving
19:00   2013 Student Scholarship Award Ceremony      
           Retired Board Director Service Recognition Awards Ceremony
19:30   A Year in Review by Liang Peng, CASPA President 2012-2013
           CASPA 2013-2014 Presidential Transition 
           Inauguration Speech by Yuping Chung, CASPA President 2013-2014
20:00   Executive Keynote: Scott McGregor, CEO, Broadcom
20:45   Performance
21:15   Prize Drawings  
21:30   Adjourns


Please check more updates here.

CIE/CASPA Technical Seminar--Recent Advances In 3D-IC And 3D-Packaging


Topic:     Recent Advances in 3D-IC and 3D-Packaging

When:     7PM-9PM, October 2, 2013

Where:    ITRI International, 2870 Zanker Rd, Suite 140, San Jose, CA 95134

Light snacks and bottle water will be served

Free Seminar Registration:  Here



Brandon Wang is currently a Director in Silicon Realization Group, overseeing Cadence’s overall 3D-IC Marketing and Product Development activities, as well as other advanced technology enablement efforts.  Prior to that, He spent over 6 years at ARM, managing the Interface IP Group, and later the PHY product line, where he also served as a member in Patent Review Committee, responsible for low power and high speed technologies. Prior to that, Brandon was with UBICOM, a network processor company that is now part of Qualcomm. Prior to that, Brandon held various technical and managerial positions with Lattice Semiconductor and Intersil. He holds a MSEE from New Jersey Institute of Technology, as well as an MBA from the Wharton School at University of Pennsylvania.

Dr. Dongkai Shangguan is currently the Founding CEO of the National Center for Advanced Packaging (NCAP China), focusing on developing and commercializing advanced microelectronics packaging technologies for the industry. Concurrently, he also serves as an Executive Advisor at the Institute of Microelectronics, Chinese Academy of Sciences.  Through his 20+ years with the industry, Dr. Shangguan worked at the Electronics Operations with Ford Motor Co. / Visteon Corporation in various technical and management function, and at Flextronics as Corporate Vice President of Advanced Technology & Engineering Leadership.  Dr. Shangguan received his BS degree in Mechanical Engineering from Tsinghua University, China, Ph.D. degree in Materials from the University of Oxford, U.K., andMBA degree from the San Jose State University.



Join CASPA Today to Create Brilliant Opportunities in Your Career and Business!




CASPA Corporate Sponsor News and Events


Financial Seminar


Friday, October 4, 2013
Fremont Marriott- - 46100 Landing Pkwy, Fremont, CA 94538
4:30 PM - 6:30 PM
Light refreshments will be served at both events.


** RSVP :, or 408-520-1518 by 23rd.


      Now may be the right time for you to think more deeply about retirement, especially since income during retirement takes on a whole new meaning. In a survey, conducted by the Society of Actuaries, 37% of individuals ages 45 to 70 said that “running out of money” will be the biggest financial challenge if they live to be 100.* 23% responded that “managing the cost of healthcare” would be the next biggest challenge. How prepared are you to meet these challenges? 

      Please join us for a special event with financial expert, author, and guest speaker Tom Hegna to learn how you can secure income for retirement that can last your lifetime. Tom Hegna, CLU, ChFC, CASL, has dedicated himself to helping individuals learn how to optimize their portfolios for retirement.


Corporate sponsor job openings 

Lenovo(Beijing)[09/2013]:Application Processor (AP) Architecture/Leader

Hot! Lenovo is actively seeking SoC chip architect with low power smart phone AP experience. There will be onsite interview opportunity for this position in CASPA's annual conference on October 12. Please send your resume to Brenda and Matt if interested.


AMD(Shanghai)[08/2013]:Principle/Senior Staff Design Architect,Senior Staff/Staff Design Lead

SMIC, Americas [07/2013]: HR and Biz Admin Manager,Field Application EngineerS



Job Openings in CASPA 2013 Job Fair

Alliance News  

[CBA]CBA 2013 Annual Conference, 10/05/2013

The Chinese Bioscience Association will host a grand conference on Oct5.

[HYSTA]Annual Conference 2013: Empowering the Next Generation Entrepreneur, 10/05/2013

This year, over 1000 people are expected to be in attendance. You will have the opportunity to meet leaders from various fields, network with talented people, and build up valuable relationships.

[SEMI]The SEMI Pacific Northwest Breakfast Forum, 10/18/2013

Theme:"New Advanced Packaging Insights on Technology and Applications".

 [CAISS] Annual Conference and Banquet, 10/19/2013

Theme: Future technologies for next-generation data storage.

[SEMI]The SEMI Pacific Northwest Breakfast Forum, 10/29/2013

Theme:"Market Outlook, EUV Update & Outlook and Metrology and Inspection Expert Panel - 450mm Development, Challenges and Applications"

[SVIEF]2013 Silicon Valley Technology Innovation & Entrepreneurship Forum, 11/2/2013

Silicon Valley Technology Innovation and Entrepreneurship Forum (SVIEF) is a one day conference designed to foster innovation and promote business partnerships between the U.S. and China.




Visit Our Sponsors



Applied Materials


Advanced Semiconductor Engineering Inc.(ASE)





Hong Kong Science & Technology Parks Corporation (HKSTP)





PricewaterhouseCoopers LLP(PwC)

Qinhuangdao Economic & Technological Development Zone





Walden International





SEMI China 


CEC Capital Management

Christopher Huang CPAs Inc.

CHT Global


Fuzhong Group

Hisilicon Technologies

Hong Kong DLong Group

ITRI International

Marvell Semiconductor Inc.




Sinochip Semiconductors Co., Ltd

Smart Electronics Industry Promotion Office

SMIC Americas


Synopsys Inc.


Ivymax Inc.

Gold Sponsors

Silver Sponsors


Quick Links


2013 Job Fair Openings 

CASPA Website

CASPA Event Calendar

Corporate Sponsor Job Openings

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CASPA Association Alliances

CASPA Industrial Alliances

CASPA Media Alliances


Contact Us


CASPA | 1159 Sonora Court, | Suite 105 | Sunnyvale | CA | 94086


Tel: (408) 940-4600