3DIC Process R&D Engineer (R-14)

Title 3DIC Process R&D Engineer (R-14)
Company TSMC
Location

Hsinchu Science Park, Taiwan

Description

       

Requirement

Minimum MS degree in Materials, Chemical Engineering and related   

TSV, BEOL or semiconductor packaging / bump process.

Contact

Email your CV, specifying the number of the position(s) you are interested in, to Daphne LEE at daphne_lee@tsmc.com