LED Wafer Bonding Engineer (NB-07)

Title LED Wafer Bonding Engineer (NB-07)
Company TSMC
Location

Hsinchu Science Park, Taiwan

Description

                      

Requirement

Minimum MS degree in EECS, Materials , Chemical, Chemistry or Physics   

Contact

Email your CV, specifying the number of the position(s) you are interested in, to Daphne LEE at daphne_lee@tsmc.com