CASPA eLetter, Issue No. 7, April 15, 2011

Jun 15, 2011

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CASPA eLetter
Issue No. 7
April 15, 2011
In This Issue
CASPA News & Upcoming Events
CASPA Corporate Sponsor News
Corporate Sponsor Job Openings
Alliance News

CASPA News & Upcoming Events

CASPA/SEMI 2011 High Tech Job Fair


Date: April 30, 2011, Saturday
10:00 AM - 4:00 PM
10:00 AM – 4:00 PM Job Fair (Salon 4, 5, 6)
10:00 AM – 3:00 PM Hiring Company Presentations (Salon 1)
09:30 AM – 4:00 PM Personal Career & Finance Forum (Salon 2, 3)
Venue: Marriott Hotel Santa Clara
2700 Mission College Boulevard, Santa Clara, CA 95054
Phone: (408) 988-1500
Admission & Parking:
FREE admission. Online Registration required. FREE Refreshments.
FREE parking (validate your parking ticket at registration desk)

Hiring companies include: AMD, AOpen, Baidu, HHNEC, Intel, Marvell, MediaTek, Neurosky, OmniVision, TSMC, Contact Singapore, Prudential, SEMI, foundries, EDA/CAE, test & assembly companies, tablet manufacturers, chipset companies, etc.

Personal Career and Finance Forum: This is a special forum for job seekers to learn about resume preparation, interview skill, compensation negotiation, and career change to service industry. You will also learn about tax and retirement planning, estate planning, wealth management, and home financing. On site resume critique will also be available.
Please visit CASPA SEMI Job Fair Website and CASPA SEMI Job Fair Openings for updated participating companies and their job openings.

Openings and Positions:
Software Engineer Web Applications Analyst

Web Designer Firmware Engineer
Device Engineer/Manager Process Integration Manager
Module Engineer Vice President, R&D
Manufacturing Engineer QRA Engineer/Manager
Yield Enhancement Engineer Project Manager
RF Designer Analog Design Engineer
Analog Design Manager RFIC Designer
Physical Design Engineer VLSI Integration Engineer
ASIC Design Manager DFT Engineer
Implementation Engineer Verification Engineer
High Speed I/O Designer FPGA Engineer
CAD Engineer Product Engineer
PCB Layout Engineer Packaging Engineer

System Architect Logic Design Engineer

Application Engineer Technical Marketing

IT Manager HR/Finance/Accounting

Sales/Account Manager Technical Writer

CASPA Special Personal Career and Finance Forum

Theme: Polish your job search skills and explore personal financial options


Date/Time: April 30th, 2011 (Saturday); 9:30am – 4:00pm

Venue: Marriott Hotel Santa Clara
2700 Mission College Blvd, Santa Clara, CA 95054
Format: English
Cost: Free. Online RSVP in advance is required to reserve seats.
RSVP: Please click CASPA Special Personal Career and Finance

Forum for RSVP online.


Morning Session
9:30a - 10:00a Registration and Networking (Refreshments provided)
10:00a - 10:10a Welcome open remark
10:10a - 10:40a Job Market Today – Domestic and Overseas
10:40a - 11:20a Improve your Resume, Interview, and Negotiation skills
11:20a - 12:00a Career change to Financial Service
12:00p - 12:30p What is new in Home Financing

12:30p - 01:30p ( Break )

Afternoon Session
01:30p - 02:15p Tax Diversifying your retirement investment
02:15p - 03:00p Wealth Management Redefined
03:00p - 03:45p Will, Trust, and You

CASPA Corporate Sponsor News

Warm Welcome to GLOBALFOUNDRIES as CASPA's new 2011 Diamond Corporate Sponsor.

Date/Time: May 20, 2011; 9:00am—4:00pm
Venue: Santa Clara Convention Center
5001 Great America Pkwy
Santa Clara, CA 95054

Please feel free to contact us at or, if you have any question regarding this event.

As one of our longtime valued customers we would like to invite you to participate in 2011 Hua Hong NEC “Unleash Your Success with Our Specialty Technology” Symposium on May 20, 2011 from 9:00 a.m. to 4:00 p.m. at Santa Clara Convention Center in Santa Clara, California.

Shanghai Hua Hong NEC Electronics Company Ltd. (“Hua Hong NEC”), one of the leading pure-play foundries, provides competitive foundry solutions that leverage its featured technology platforms and expertise in Embedded Non-Volatile Memory, Discrete Device, Analog and Power Management IC, HV CMOS and RF CMOS, etc. During this Symposium, we will disclose the latest technology roadmap and reveal detailed information on our featured foundry technology platforms.

In addition to a face-to-face communication with our technology team, there will be a number of lucky draws. To be eligible for any of the draws you will be required to bring two business cards (one for the lucky draw and another one for the name badge).

Please Click here to complete the online registration or you can download the registration form to fill and fax (+86-21-58344909*9170) or email back us at

Yours Sincerely,
Feng Gao
Vice President of Sales & Marketing
Shanghai Hua Hong NEC Electronics Company Ltd.

Corporate Sponsor Job Openings

CASPA corporate sponsors have the following new job openings. Please click on each to view or visit Corporate Jobs at CASPA website.

1. S3 (Social Semantic Search) Engineer NEW !


1. Sr. Analog/Mixed Signal Design Engineer NEW !
2. Manager Analog Design Engineering NEW !
3. Principal Audio Applications Engineer NEW !
4. ASIC Staff Design Engineer NEW !

C. NeuroSky

1. ASIC Staff Design Engineer NEW !

Alliance News
Chinese Institute of Civil Engineers-San Francisco Chapter
2011 Civil Engineering Seminar One
Bridge Engineering
Date/Time: April 17th 2011; 2:30PM-5:00PM
Location: San Francisco State University
1600 Holloway Avenue, Science Building 101
San Francisco, CA
Host Institute: San Francisco State University
Presentation Company: TYLin International
Reception: Qiming Zeng
Moderator: Dr. Zhenyu Zhu
Program Schedule:
2:30PM 30 min N/A Pre-seminar Social
3:00PM 10 min Dr. Wen Wang CIE-SF Chapter
3:10PM 10 min Dr. Zhenyu Zhu Civil Engineering Group
3:20PM 10 min Dr. Cheng Chen SFSU/Civil Engineering
3:30PM 45 min Tom Ho Chongqing: Bridge Capital of China
4:15PM 45 min Paul Chou Bridge Engineering in 3D World

SMART TECHnology World: April 19-20
Ritz-Carlton in San Francisco, CA
An IDC Event
Join the SMART discussions at SMART TECHnology World!
SPECIAL OFFER: Register before March 11 and save $600 off the on-site price and receive IDC Semiconductor's Predictions report for 2011 plus your choice of one special report or market model relating to topics addressed at the conference. The Semiconductor research is valued at over $3,000. Register now and take advantage of both offers!
Through this two-day, content rich agenda designed and developed by IDC, you will learn about the opportunities that are taking hold in the smart technology value chain. Gain knowledge and actionable guidance, insightful perspectives from industry leaders and IDC on the new technologies and services on the horizon for smart devices and their ecosystems.
Agenda highlights include:
Insightful keynotes and track session presentations from:
- Intel's Ton Steenman, Vice President and General Manager, Embedded & Communications Group
- Freescale's Lisa Su, Senior Vice President and General Manager, Networking and Multimedia
- Microsoft's Kevin Dallas, General Manager, Windows Embedded Business
- General Motors' Byron Shaw, Managing Director, Advanced Technology
- Samsung's Ana Hunter, Vice President of Technology and Foundry Services
- Motorola Mobility's Omar Javaid, Vice President, Converged Solutions
- Sprint-Nextel's Tim Johnson, In-Vehicle Connectivity/Telematics
- Flextronics' EC Sykes, President Flextronics Industrial
- Texas Instruments' Deepu Talla, General Manager, OMAP Mobile Computing Business Unit
- InvenSense's Steven Nasiri, President and CEO
- Icera's Jim Finch, Vice President of Marketing
- Marketing Leader, Reynette Au, former VP Marketing and Alliances at Atheros and ARM
- IDC's Mario Morales, Program Vice President, Semiconductor and EMS Research
- SMART conversations and panel discussions exploring the future of the embedded systems market
- SMART Ecosystem breakout sessions covering: consumer; next generation communications and automotive; enabling software & services; industrial & energy; manufacturing technology & supply chain
To view the complete program agenda and register today go to
*Be sure to registration code Association_01 when registering.

ITRI Presents
2011 Taipei Nankang IC Design Incubation Center
Silicon Valley Event
Great opportunity for U.S. IC Design (or related) companies/start-ups!!
Date/Time: 4/25 (Monday); 10:00 am - 12:00 pm
4/25 (Monday) ~ 4/29 (Friday) 10:00 am - 6:00 pm
(Each interview lasts 1 hr.; RSVP required)
Venue: ITRI International, Inc., 2870 Zanker Road, Suite 140,
San Jose, CA 95134
Contact: Yuping Chen (;TEL:(408) 428-9988 ext. 19
Nankang Center home page:
2011 Silicon Valley event:

2011 NACSA China Trip Invitation
Thanks for great support from major Chinese Hi-Tech and Science Parks and NACSA members, 2011 NACSA China Trip preparation has made huge progress. We would like to announce more detailed information about this trip.
China Trip Itinerary:
* May 8, 2011 (Sunday): Report to delegation lead at the hotel
* May 9, 2011 (Monday) - May 16, 2011 (Monday)
o Shanghai
o Jiaxing
o Taicang
o Suzhou
o Wuxi
o Zhenjiang
o Nanjing
* Delegates are responsible for their own airfare to China
* $600 advanced payment for additional expenses at China
How to Join this China Trip?
* Download the Registration and BP Templates at and fill out them
* Submit your Registration and BP to and mail your advanced payment to us by 3/25/2011
* NACSA China Trip Committee will review your business plan and provide valuable feedback
* Finalize travel plans by 4/8/2011
For more information about 2011 NACSA China Trip, please visit our website at If you have questions about NACSA 2011 China Trip or need any help, please do not hesitate to send an email to
Please visit for details.

Thank you for your kind attention and generous support. We look forward to seeing you at CASPA events.


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