CASPA eLetter, Issue No. 14, June 30, 2011

Dec 16, 2012

caspa image banner 5_2
CASPA eLetter
Issue No. 14
June 30, 2011
 
In This Issue
CASPA News & Upcoming Events 
CASPA Corporate Sponsor News  
Corporate Sponsor Job Openings
Alliance News 

CASPA News & Upcoming Events

Dinner Seminar

Power Management IC Markets  & Opportunities In China
Speaker: Dr. Yi Zhang
CEO and founder
Shanghai LeadChip Microelectronics Corp. Ltd

Date:     July 9, 2011 (Saturday)
Time:       5:30 p.m. to 8:15 p.m
Venue:     ChinaStix Restaurant
               2110 El Camino Real
               Santa Clara, CA 95050
               Tel: (408) 244-1684
Registration Fee: $10/per person.
This is NOT a free event and is by invitation ONLY. Seats are limited and advanced reservation is required.    Your registration is NOT completed until the registration fee is received. Please show up at the event on time and pay on site by check or cash and NOT by mail.   No admission will be allowed without proof of payment.
RSVP:       To make on-line reservation, pls click CASPA Power Management Reservation .

Schedule:
5:30 p.m. to 6:00 p.m. ---  Registration and Networking
6:00 p.m. to 6:30 p.m. ---  Dr. Yi Zhang's Presentation 

                                        on Power Semiconductor IC Opportunities
6:30 p.m. to 7:45 p.m. ---  Dinner
7:45 p.m. to 8:15 p.m. ---  Networking
 
On behalf of Chinese American Semiconductor Professional Association (CASPA), we cordially invite Dr. Yi Zhang as a distinguished speaker for the “Power Management IC Opportunities” seminar.

Dr. Zhang is the CEO of Shanghai LeadChip Microelectronics Corp. Ltd., which was started and registered on November 21 2007 with 150 employees as of today. Leadchip is the only power IC company in China that has strong support in 4-inch, 5-in, 6-inch and 8-inch wafer production lines. These lines meet all the needs of the power IC industry, so that they can optimize performance over cost to a level hard for competitors to match. With these manufacturing resources and huge package volumes, Leadchip offers customers high performance and cost effective products. The proprietary high voltage process it co-developed with Belling enables the company to also compete with non-Asia competitors. The 100V and 600V MOSFET driver series that Leadchip developed can be widely used for motor drives, air conditioning and lighting markets, etc. Leadchip devotes to save 86% of  its electric usage. Its mission is to become an energy-saving company.

 


CASPA / CIE Summer Symposium
Global Collaboration - Technology and Social Science for Human Advancements

Date: July 16, 2011 (Saturday)
Time    12:00 pm-06:00pm
Venue: Intel Headquarter SC12 Auditorium
           3600 Juliette Lane, Santa Clara, CA 95054
Agenda:
12:00 am – 12:45 am Registration & Networking
12:45 am – 01:00 pm Welcome by CASPA/CIE
01:00 pm – 03:00 pm Session I: Social Cloud
03:00 pm – 03:15 pm Break
03:15 pm – 05:30 pm Session II: Culture Fusion
05:30 pm – 06:00 pm Social Network
RSVP: Register online by Clicking Summer Symposium Registration . 
Admission: Free admission, free parking, free refreshments.
Session I: Social Cloud
A new technology revolution is emerging in the Silicon Valley. Social networking is creating internet traffic which in turn is pushing the cyber commerce. The impact of supporting the bandwidth, and speed to keep everyone connected in the world create a huge demand for semiconductor. The connectivity by smart phones, e-readers, and tablet PC as well as the traditional notebook and PC is now the growth engine for memory, touch sensor, WIFI, and MCU devices.  Cloud computing is converging as a social and business platform for entertainment as well as information innovation.    The backbone of the cloud is the infrastructure of server farms and IP security which is also source of innovation in semiconductor.  The combination of social network and cloud computing will create new 21th century society where our personal life is enriched and career opportunities are expanded.
Speakers/Topics                                   
Mr. Rory McInerney, VP Intel                           
  Intel’s Vision of Cloud Computing in 2015
Mr. Mario Morales, VP IDC Analyst                  
  Enabling Technology Driving Semiconductor in Next 5 Years
Mr. Ricky Ma, Head Of Technology Cluster     
  GreenTech business Opportunities in HK / China HK Science Tech. Park
Mr. Sunny Hui, VP SMIC-USA                          
  New Generation of Thinking of Semi. Technologies For Smart Devices

Session II:  Culture Fusion
Asians have a long civilization history in their native continents and Asian immigrants have become one of the key ethnic components of the United States. Comparing to other ethnic groups, Asian Americans have taken a long way to achieve today’s status, and are still actively pursuing their fair share of cultural, political and economical rights.  This panel has 4 heavy weight Asian activists (Dr. Fred Hsia, Dr. Chenming Hu, Dr. Talin Hsu and Mr. Ling Wu) to discuss about the two Cultures, political and social activism, leadership and success in the main stream society.  It will benefit both new comers and established Asians in the US, including the Asian engineers and the entrepreneurs.
Speakers/Topics
Dr. Frederick Hsia, Prof of Literature at NCKU, NTHU               
  Two Cultures
Dr. Ta-Lin Hsu, Founder & Chairman H&Q Asia Pacific            
  Development of Asian Philanthropy
Dr. Chenming Hu, Professor at UC Berkeley                            
  Political & Social Activism
Mr. Ling Wu: VP Broadvision                                                    
  Another Angle of Leadership

CASPA Corporate Sponsor News

 

Warm Welcome to MEMSIC   as CASPA's new 2011 Gold Corporate Sponsor.

Corporate Sponsor Job Openings

CASPA corporate sponsors have the following new job openings.  Please click on each to view or visit Corporate Jobs   and Sponsor Jobs at CASPA website.
A. TSMC

1. CAD Engineer                                                NEW !
2. Layout Engineer/Technical Manager                  NEW !

B. Contact Singapore

1. Senior Manufacturing Engineer                        NEW !

C. Infineon China (IFCN)

I. Location: Shanghai                                                      NEW !
1. Application Engineer - PL54 RF Power
2. KAM Sales Manager/Sr. Sales Manager (IMM) ** Location: Shanghai / Shenzhen / Beijing
3. System Application Engineer/Sr. SAE - PL52
4. Technical Marketing Engineer / Senior Tech Marketing Engineer - PL52 EV Charger
5. Regional Application Engineer – Smart Meter
6. System Application Engineer/Sr. SAE – PL21
7. Technical Manager (Application Engineering) – PL33
8. Staff Application Engineer/Sr. Staff AE (ATV)
II. Location: Shenzhen                                                    NEW !
9. Application Engineer/Sr. Application Engineer – LED Lighting Application
10. Application Engineer / Sr. Application Engineer – PL33

D. AMD

1. MTS Product Development Eng (SLT Test)               
2.
MTS Product Development Eng (GPU ATE Test)        

E. SMIC

1. SMIC World Business Office Openings                      
2. SMIC TD, and Operation Job Openings                    

Alliance News  

Monte Jade July mHealth Forum
Date: July 20th  (Wednesday)
Time: 6:30pm-9:00pm
Venue: ITRI International, 2870 Zanker rd Suite 140 San Jose 95134
Speaker bio and register: www.montejade.org
Panelists:
  Yan Chow, Kaiser Permanente Information Technology
  IBM Executive
  More detail coming up!!
 

 
 
Thank you for your kind attention and generous support.  We look forward to seeing you at CASPA events.

Sincerely,


CASPA
eLetter Publication

QUESTIONS: Please do not reply to this message. If you have any questions or need further information, please contact our office at office@caspa.com.

UNSUBSCRIBE: Click here with "UNSUBSCRIBE" in the subject line to unsubscribe.
Copyright 2011 CASPA. All rights reserved.
 

Diamond Sponsors
Visit Our Sponsors

AMD

GLOBALFOUNDRIES

Hong Kong Science & Technology Parks Corporation (HKSTP)

HSBC Bank USA, N.A.

Intel

Prudential Life Insurance Company 

Qinhuangdao Economic & Technological Development Zone

Semiconductor Industry Promotion Office, DB, MOEA

TSMC

Warden International
Wilson Sonsini Goodrich & Rosati

Platinum Sponsors

Gold Sponsors

Silver Sponsors

Quick Links

 

2011 Job Fair Openings 

CASPA Website

CASPA Event Calendar

Corporate Sponsor Job Openings

eLetter Archives

CASPA Association Alliances

CASPA Industrial Alliances

CASPA Media Alliances

CASPA Photo Gallery

Contact Us

 

 CASPA | 1159 Sonora Court, | Suite 105 | Sunnyvale | CA | 94086


 

Tel: (408) 940-4600
 
Email: office@caspa.com
Website: www.caspa.com