CIE/USA-SF EPMC Group January Seminar01/13/2015 - 01/13/2015

CIE/USA-SF EPMC Group January Seminar

The EPMC (Electronics Packaging and Manufacturing Committee) Group of CIE/USA-SF and co-sponsor ITRI International will hold the January Seminar featuring “PoE (Power over Ethernet) IC Test and Assembly and “Testing telecommunication products on ATE.  All CIE/USA-SF members and non-members are cordially invited to attend this very informative seminar.

- PoE (Power over Ethernet) IC Test and Assembly  by Dr. Chengping Wang, Akros Silicon

- Testing telecommunication products on ATE (Automatic test equipment) by Mr. ChingChia Tien, LTXCredence
January 13, 2013 (Tuesday) 7:00 - 9:00 pm (registration starts at 6:30pm)
ITRI International, 2870 Zanker Rd., Suite #140, San Jose, CA 95134.  (Free parking)
Free admission for CIE-SF members, $5 for non-CIE-SF members
Pre-registration on-line is required:  Please click here to register on-line.
CIE/USA-SF membership:
Please visit to join CIE-SF membership and enjoy discounts to all CIE-SF events.
ITRI International, Inc.
PoE (Power over Ethernet) IC Test and Assembly
Power over Ethernet (PoE) has gained popularity over the years from the demand for more network-powered appliances. The applications include VoIP phone, PTZ IP camera, WAP, RFID terminals, thin-client computers and fiber-to-the-home (FTTH) terminal. More solutions have moved from discrete components to SoC chip for reducing BOM cost. The power capability has been increased from 13W to 60W recently and 90W+ in the future for supporting more applications. The technology has also been developed to embed 7kV isolator on a single package PD (Powered Device) device for energy conservation & management. This presentation introduces the latest advance on PoE solution with focus on PD, the corresponding test challenges and packaging requirements.
Dr. Chengping Wang has over 17 years of experience in semiconductor test engineering. Currently he is Director of Operations at Akros Silicon inc. where he manages test/product engineering, QA and manufacturing for PoE products. Prior to Akros, Mr. Wang was Test Engineering Manager for Audio Solution Group in Maxim Integrated. He also held other test engineering positions at Maxim and Texas Instruments.


Testing telecommunication products on ATE (automatic test equipment)

RF wireless transceiver and high speed wired transceiver present different test challenges. For RF transmitter, the challenges lie on spectrum control (Adjacent channel power ratio) and constellation accuracy (error vector magnitude). For Ethernet, it lies on warrantee extremely low BERT (bit error rate test). For both wireless and wired receiver test, the challenge lies on generating modulated filtered signal.
This presentation covers the following topics
·         EVM and ACPR measurements for WiFi and Zigbee,
·         Sinusoid approximation: spectrum re-growth, IQ imbalance, phase noise
·         Sub-second BERT by applying one side limit stressed signal with statistical estimation   
·         Modulated signal generation
Mr. ChingChia Tien is a principle RF application engineer at LTXCredence. He developed 802.11 b, 801.11G, and 802.15.4 (zigbee) EVM code on various tester platforms in the past 12 years. He worked on OC192 and 10 G Ethernet for Lucent Technology in early 2000.